The power module combines most of the necessary components to provide a plug and play solution, replacing over 40 different components. This integration can simplify and accelerate system design, and it can also significantly reduce the circuit board area occupied by the power management section. In order to achieve the required voltage accuracy, these power modules are generally placed on the circuit board near the chip circuit that needs to be powered. However, as the complexity of the system increases, layout becomes more important in systems with larger currents, lower voltages, and higher frequencies.
*The common isolated power module is a single in line package (SIP) and open shelf structure. They can obviously bring convenience to engineers and simplify system design. However, generally speaking, they are only suitable for designs with lower switching frequencies, such as 300kHz or lower. Furthermore, their power density is often not optimized, especially compared to DC/DC chip level modules.
The isolation of power modules is generally divided into two types: one is the isolation between input and output; The input and output are not in common; Another type is isolation between outputs; Multiple sets of outputs are isolated from each other and do not interfere with each other.
With the development of conductor, especially semiconductor technology, packaging technology, and the widespread use of high-frequency soft switches, the density of power modules is increasing, and the conversion efficiency is also increasing. Applications are also becoming simpler and simpler. The direction of development is to make the power supply lighter, smaller, thinner, with lower noise, higher reliability and anti-interference.